Onkyo DX 6550 Service Manual
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Extracted text from Onkyo DX 6550 Service Manual (Ocr-read)
Page 1
SERIAL NO. 3307
ONKYO® SERVICE MANUAL
IIIIIIIIIIIIIIIIIIIIIIIIIII
COMPACT DISC PLAYER
MODEL DX-6550 '
Black and silver models
SAFETY-RELATED COMPONENT WARNINGII
COMPONENTS IDENTIFIED BY MARK A ON THE
SCHEMATIC DIAGRAM AND IN THE PARTS LIST ARE
CRITICAL FOR RISK OF FIRE AND ELECTRIC SHOCK.
REPLACE THESE COMPONENTS WITH ONKYO PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL
MAKE LEAKAGE-CURRENT 0R RESISTANCE MEA-
SUREMENTS TO DETERMINE THAT EXPOSED PARTS
ARE ACCEPTABLY INSULATED FROM THE SUPPLY
CIRCUIT BEFORE RETURNING THE APPLIANCE TO
THE CUSTOM ER.
ON KYO
AIIIIIII IIIIMPIIIIIIIIS
SPECIFICATIONS
Signal readout system:
Reading rotation:
Optical non-contact
About 500~200 r.p.m.
(constant linear velocity)
Linear velocity: 1.2~1i4m/s
Error correction system: Cross interleave readsolomon
code
18 bits linear
176.4kHz (four-times
oversampling)
Number of channels: 2 (stereo)
Frequency response: 5H2~20kHz
Total harmonic distortion: 0,003% (at lkHz)
Dynamic range: 9613B
Signal to noise ratio: 96dB
Channel separation: 96dB (at IkHz)
Wow and Flutter: Below threshold of
measurability
Power consumption: 15 watts
Output level: 2 volts r,m.s.
Dimensions (WXHXD): 435Xl3l><365 mm
17-1/ "XS-ll ><14-7/16
8kg, 176 lbs.
Decoded bits;
Sampling frequency:
Weight:
Specifications are subject to change without notice.
-1-
Page 2
DX-6550
TABLE OF CONTENTS
Specifications ...................................
Service procedures ...........................
Note on compact disc ...................................
Protection of eyes from laser beam during servicing ..
Laser warning label ...................
Caution on replacement of pickup
Packing View ...............................................
Chassis-exploded view .....
Parts list ....................
Mechanism-exploded view
Parts list .......................
Disassembling procedures . .
Lubrication ...................................................... 12
IC block diagram and descriptions
Adjustment procedures .................
Printed circuit board View from bottom side
Main circuit ...............
Other pc boards
Printed circuit board»parts list
Block diagram ..........................
SERVICE PROCEDURES
1. How to Release the Transport Lock
To protect the optical assembly including the laser pickup
from vibration related damage during shipping, this unit
is equipped with a transport lock lever located on the base.
all a
head screwdlivev
Lock'lever 3 Hole
4
l
0 Use a screwdriver to turn the lock lever (about 90°) in
the round hole in the direction of arrow ( 0 ).
0 Before transporting the unit again, stand it with its left
side facing down, and turn on the power. Wait 2-3
seconds and then turn the lock lever in the opposite
direction of the arrow.
Fig. 1
2. Safety-check out
After correcting the original service problem, perform the
following safety check before releasing the set to the
customer;
Connect the insulating-resistance tester between the plug
of power supply cable and chassis.
Specifications: more than lOMohm at 500V.
3. Procedures for replacement of flat packaged ICs
1. Tools to be used:
(1) Soldering iron .. .. Grounded soldering iron or
soldering iron with leak re-
sistance of 10 Mohms or
more.
Form of soldering irons tip:
(2) Mnytifyingglass . .. for checking of finished
. works
(3) Tweezers ........ for handling of IC and
forming of leads
(4) Grounding ring. . . . Countenneasure for electro-
static breakdown
(5) Nipper ......... for removing defective [C
(6) Small brush ...... for application of flux
2. Work Procedures:
(1) Remove the defective lC
Cut all leads of the defective 10 one by one using
a nipper and remove the IC.
(2) Clean the pattern surface of the PC board.
Get rid of the remaining leads and solder.
(3) Check and from the leads of the new flat pack-
aged IC to be installed.
From every lead on the new [C using a pair of
tweezers, so that all of them are aligned neatly
without being risen, twisted or inclined toward
one side. Especially the rising portion of every
lead must be formed with greatest care,
i IC § ! IC é ; IC é/
(Rising) (Twisting) (Inelining)
Fig. 3
(4) Apply flux to the PC board.
Apply flux to the pattern surface of the PC board
which has been cleaned, as shown in the illustration.
The area to be applied with flux is the portion of
about 2.5mm in width where the [CS leads are to
be soldered.
Be careful to apply minimum amount of flux
required so as not to smear it on unwanted areas.
gag
About 2.5 mm
Fig. 4