Onkyo DX 5700 Service Manual

Page 1

SERIAL NO. 3352

ONKYO® SERVICE MANUAL

COMPACT DISC PLAYER
MODEL DX-5700

Black model

BUDN, BUD

120V AC. 60 Hz

BUG

220V AC, SOHz

BUU, BUUX

l10/120/220/240V AC, 50/60Hz

BUQA, BUQB

240V AC, 50 Hz

SAFETY-RELATED COMPONENT WARNING

COMPONENTS IDENTIFIED BY MARK A ON THE
SCHEMATIC DIAGRAM AND [N THE PARTS LIST ARE
CRITICAL FOR RISK OF FIRE AND ELECTRIC SHOCK.
REPLACE THESE COMPONENTS WITH ONKYO PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL.

MAKE LEAKAGE-CURRENT OR RESISTANCE MEA-
SUREMENTS TO DETERMINE THAT EXPOSED PARTS
ARE ACCEPTABLY INSULATED FROM THE SUPPLY
CIRCUIT BEFORE RETURNING THE APPLIANCE TO
THE CUSTOMER.

ONKYO I,
JIIIIlIu BUMPnutNIsI

SPECIFICATIONS

Signal readout system:
Reading rotation:

Optical non-contact
About 500~200 r.pim.
(constant linear velocity)

Linear velocity: l.2~l,4m/s

Error correction system: Cross interleave readsolomon
code

Decoded bits: 18 bits linear

Sampling frequency: 352.8kHz (Eight-times
oversampling)

Number of channels: 2 (stereo)

Frequency response: 2H2~20kHz

Total harmonic distortion: 0,0025% (at 1kHz)

Dynamic range: lOOdB

Signal to noise ratio: IIOdB

Channel separation:
Wow and Flutter:

103dB (at IkHz)

Below threshold of
measurability

18 watts

2 volts r.m,si

435x13] X365 rnrn
17-1/8X5-1/8"><14-7/16"
8.2kg. 18.11225

Power consumption:
Output level:
Dimensions (W X H X D):
Weight:

Specifications are subject to change without notice

Page 2

I X-5700

TABLE OF CONTENTS

Specifications ........... .. 1
Service procedures . . 2
Note on compact disc .......................................... 3

Protection of eyes from laser beam during servicing ..
Laser warning label .....................
Caution on replacement of pickup
Packing view
Chassis-exploded View
Parts list ............................
Mechanismcxploded view
Parts list ............................
Disassembling procedures t. ll

Lubrication ................... 12
[C block diagram and descriptions l3
Adjustment procedures iiiiiiiiiiiiiiiiiii . 22

Printed circuit board view from bottom side
Main circuit ....... 25
Other pc boards .
Printed circuit board-parts list
Block diagram .........................

SERVICE PROCEDURES

1. How to Release the Transport Lock

To protect the optical assembly including the laser pickup
from vibration related damage during shipping, this unit
is equipped with a transport lock lever located on the base.

Phillips

head screwdriver

0 Use a screwdriver to turn the lock lever (about 90°) in
the round hole in the direction of arrow ( 0 )r

0 Before transporting the unit again, stand it with its left
side facing down. and turn on the power. Wait 2-3
seconds and then turn the lock lever in the opposite
direction of the arrow

Fin. 1

2. Safety-check out

After correcting the original service problem, perform the
following safety check before releasing the set to the
customer:

Connect the insulating-resistance tester between the plug
of power supply cable and chassis

Specifications: more than lOMohm at 500V

3. Procedures for replacement of flat packaged [Cs
1. Tools to be used:
(1) Soldering iron . i . . Grounded soldering iron or
soldering iron with leak re-
sistance of 10 Mohms or

more.

Form of soldering irons tip:

E: m

(2) Magnifyinggkss . . . for checking of finished

works

(3) Tweezers ........ for handling of IC and
forming of leads

(4) Groundingring. . . . Countermeasure for electro-
static breakdown

(S) Nipper ......... for removing defective [C

(6) Small brush ...... for application of flux

2. Work Procedures:

(1) Remove the defective [C
Cut all leads of the defective [C one by one using
a nipper and remove the IC.

(2) Clean the pattern surface of the PC board.
Get rid of the remaining leads and solder.

(3) Check and from the leads of the new flat pack-
aged [C to be installed.
From every lead on the new [C using a pair of
tweezers, so that all of them are aligned neatly
without being risen, twisted or inclined toward
one side. Especially the rising portion of every
lead must be formed with greatest caret

IC SE IC g g It: E/
(Rising) lTwrst-ng) (Inclinlng)

Fig. 3

(4) Apply flux to the PC board.

Apply flux to the pattern surface of the PC board
which has been cleaned, as shown in the illustration.
The area to be applied with flux is the portion of
about 2.5mm in width where the [CS leads are to
be soldered.

Be careful to apply minimum amount of flux
required so as not to smear it on unwanted areas.

ass

About 2.5 mm

Fig. 4