Onkyo DX 5500 Service Manual

Page 1

DX-55

SERIAL NO. 3307

ONKYO® SERVICE MANUAL

COMPACT DISC PLAYER

MODEL DX-5500
Black model
BUDN, BUD 120V AC, 60 Hz
BUG 220V AC, SOHz
BUU, BUUX llO/l20/220/240V AC, 50/60Hz
BUQA, BUQB 240V AC, 50 Hz

SAFETY-RELATED COMPONENT WARNINGI!

COMPONENTS IDENTIFIED BY MARK A ON THE
SCHEMATIC DIAGRAM AND IN THE PARTS LIST ARE
CRITICAL FOR RISK OF FIRE AND ELECTRIC SHOCK.
REPLACE THESE COMPONENTS WITH ONKYO PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL.

MAKE LEAKAGE-CURRENT OR RESISTANCE MEA»
SUREMENTS TO DETERMINE THAT EXPOSED PARTS
ARE ACCEPTABLY INSULATED FROM THE SUPPLY
CIRCUIT BEFORE RETURNING THE APPLIANCE TO
THE CUSTOMER.

ONKYO
AIIIIIII BUMPIIIIHIIS

SPECIFICATIONS

Signal readout system:
Reading rotation:

Linear velocity:
Error correction system:

Decoded bits:
Sampling frequency:

Number of channels:
Frequency response:

Total harmonic distortion:

Dynamic range:
Signal to noise ratio:
Channel separation:
Wow and Flutter:

Power consumption:
Output level:
Dimensions (WX H X D):

Weight:

Optical non-contact
About 500~200 rpm.
(constant linear velocity)
1,2~1.4m/s

Cross interleave readsolomon
code

18 bits linear

I76,4kHz (four-times
oversampling)

2 (stereo)

5Hz~20kHz

0.003% (at 1km)
96dB

96dB

96dB (at 1kHz)

Below threshold of
measurability

15 watts

2 volts r.m.s.
435x131><365 mm
17-1/8><5-1/8><14-7/16"
8kg, 17.6 lbs.

Specifications are subject to change without notice,

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-5500

TABLE OF CONTENTS

Specifications ..................................................... 1
Service procedures
Note on compact disc
Protection of eyes from laser beam during servicing .. 4
Laser warning label ............................................. 4
Caution on replacement of pickup
Packing view ................
Chassis-exploded View .

Parts list ................... ..
Mechanism-exploded view 10
Parts list ........................... 11

Disassembling procedures
Lubrication .................................
IC block diagram and descriptions ,. ..
Adjustment procedures ...................................... 22
Printed circuit board view from bottom side

Main circuit

Other pc boards ,, 29
Printed circuit board-parts list .. 27
Block diagram .................................................. 31

25

SERVICE PROCEDURES

1. How to Release the Transport Lock

To protect the optical assembly including the laser pickup
from vibration related damage during shipping, this unit
is equipped with a transport lock lever located on the base.

a

Phllllps \
head screwdriver

0 Use a screwdriver to turn the lock lever (about 90°) in
the round hole in the direction of arrow ( O ).

0 Before transporting the unit again, stand it with its left
side facing down, and turn on the power. Wait 2-3
seconds and then turn the lock lever in the opposite
direction of the arrow.

Fig. 1

2. Safety-cheek out

After correcting the original service problem, perform the
following safety check before releasing the set to the
customer:

Connect the insulating-resistance tester between the plug
of power supply cable and chassis.

Specifications: more than IOMohrn at 500V.

3. Procedures for replacement of flat packaged KS
1. Tools to beused:
(l) Soldering iron Grounded soldering iron or
soldering iron with leak re-
sistance of 10 Mohms or

more.

Form of soldering irons tip:

(2) Magnifying glass . .i for checking of finished

works

(3) None ........ for handling of 1C and
forming of leads

(4) Groundingring . . . . Countermeasure for electro-
static breakdown

(5) Nipper ......... for removing defective IC

(6) Small brush ...... for application of flux

2. Work Procedures:

(1) Remove the defective lC
Cut all leads of the defective IC one by one using
a nipper and remove the IC.

(2) Clean the pattern surface of the PC board.
Get rid of the remaining leads and solder.

(3) Check and from the leads of the new flat pack-
aged lC to be installed.
From every lead on the new [C using a pair of
tweezers, so that all of them are aligned neatly
without being risen, twisted or inclined toward
one side. Especially the rising portion of every
lead must be formed with greatest care.

5 IC § IC § IC /
\ E
(Rising) iTwisting) (lnelining)

Fig. 3

(4) Apply flux to the PC board.

Apply flux to the pattern surface of the PC board
which has been cleaned, as shown in the illustration.
The area to be applied with flux is the portion of
about 2.5mm in width where the [CS leads are to
be soldered.

Be careful to apply minimum amount of flux
required so as not to smear it on unwanted areas.

gag

About 25 mm

Fig. 4