Onkyo DX 530 Service Manual

Page 1

SERIAL NO 3270

ONKYO® SERVICE MANUAL

COMPACT DISC PLAYER
MODEL DX-530

Black model
BUDN, BUD 120V AC, 60 Hz
BUG 220V AC, SOHz
BUU, BUUX l 10/120/220/240V AC, 50/60Hz
BUQA, BUQB 240V AC, 50 Hz

SAFETY-RELATED COMPONENT WARNINGII

COMPONENTS IDENTIFIED BY MARK A ON THE
SCHEMATIC DIAGRAM AND IN THE PARTS LIST ARE
CRITICAL FOR RISK OF FIRE AND ELECTRIC SHOCK.
REPLACE THESE COMPONENTS WITH ONKYO PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL.

MAKE LEAKAGECURRENT OR RESISTANCE MEA-
SUREMENTS TO DETERMINE THAT EXPOSED PARTS
ARE ACCEPTABLY INSULATED FROM THE SUPPLY
CIRCUIT BEFORE RETURNING THE APPLIANCE TO
THE CUSTOMER.

ONKYO
IIIIIIIII BIIMPIIIIEIIIS

SHAFT A TV

SPECIFICATIONS

Signal readout system:
Reading rotation:

Optical noncontact

About 500~200 r.p.m.

(constant linear velocity)

l.2~l .4rn/s

Cross interleave readsolomon code
16 bits linear

88.2kHz (two-times oversampling)

Linear velocity:

Error correction system:
Decoded bits:

Sampling frequency:

Number of channels: 2 (stereo)
Frequency response: 2Hz~20kHz
Tmal harmonic distortion:0.003% (at lkllz)
Dynamic range: 93dB

Signal to noise ratio: 96dB

Channel separation:
Wow and Flutter:

Power comsumption:
Output level:
Dimensions (W x H x D):

90dB (at lkflz)

Below threshold of measurabflity
17 watts

2 volts r.m.s.

435 x 92 x 364mm

17-1/8 x 3-5/8" x 14-5/16
Weight: 5.6kg, 12.3 lbs.

Specifications are subject to change without notice,

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DX»53D

TABLE OF CONTENTS

Specifications ............................ 1
Service procedures ....................... 2
Note on compact disc ...................... 3
Protection of eyes from laser beam during servicing . . . . 4
Laser Warning label ......................... 4
Caution on replacement of pick-up .............. 6
Packing View ............................. 7
Exploded View ............................ 8
Parts list ................................ 9
Mechanism exploded view ................... 10
Parts list ............................... 1 l
Disassembling procedures .................... 12
1c block diagram & descriptions ................ l4
Flowchart of operation ..................... 21
Connection diagram of microcomputer ........... 23
Circuit descriptions ....................... 24
Adjustment procedures ..................... 28
Printed circuit board View from bottom side ....... 31
Printed circuit board-parts list ................. 33
Block diagram ........................... 37

SERVICE PROCEDURES

1. Removing the Locking Plate

Locking plate is located on the bottom panel of this unit.
Before using this unit for the first time, the plate must be
removed. if power is switched on while this part is still in
place, the unit will not operate properly

1. Locking plate
2. Tapping screw

Fig. 1

2. Safety~check out (U.S.A. model)

After correcting the original service problem, perform the
following safety check before releasing the set to the
customer:

Connect the insulating-resistance tester between the plug
of power supply cable and chassis.

Specifications: more than lOMohm at 500V.

3. Procedures for replacement of flat packaged [Cs
1. Tools to be used:
(1) Soldering iron Grounded soldering iron or
soldering iron with leak re-
sistance of 10 Mohms or

more.

Form of soldering irons tip:

(2) Mamifyingglnss . .. for checking of finished

works

(3) Tweezers ........ for handling of IC and
forming of leads

(4) Grounding ring. . .. Countermeasure for electro-
static breakdown

(5) Nipper ......... for removing defective 1C

(6) Small brush ...... for application of flux

2. Work Procedures:

(1) Remove the defective [C
Cut all leads of the defective IC one by one using
a nipper and remove the IC.

(2) Clean the pattern surface of the PC board.
Get rid of the remaining leads and solder.

(3) Check and from the leads of the new flat pack-
aged IC to be installed.
From every lead on the new 1C using a pair of
tweezers, so that all of them are aligned neatly
without being risen, twisted or inclined toward
one side. Especially the rising portion of every
lead must be formed with greatest care.

is g IC g 3 IC i/
ersing) lTwrstingl ilnelining)

Fig. 3

(4) Apply flux to the PC board.

Apply flux to the pattern surface of the PC board
which has been cleaned, as shown in the illustration.
The area to be applied with flux is the portion of
about 2.5mm in width where the lCs leads are to
be soldered.

Be careful to apply minimum amount of flux
required so as not to smear it on unwanted areas.

as?

About 2.5 mm

Fig. 4