Onkyo DX 330 Service Manual

Page 1

DX-330
SERIAL NO. 3247

ONKYO® SERVICE MANUAL

COMPACT DISC PLAYER
MODEL DX-330

Black and Silver models

I BUDN, BUD 120V AC, 60 HZ

BUG, UG 220V AC, SOHz

BUU, BUUX 110/120/220/240V AC, 50/60Hz

BUQA, BUQB 240V AC, 50 Hz

SAFETY-RELATED COMPONENT WARNING SPECIFICATIONS

COMPONENTS IDENTIFIED BY MARK A ON THE Signal readout system: Optical non-contact
SCHEMATIC DIAGRAM AND IN THE PARTS LIST ARE Reading rotation: About 500~200 r.pm.
CRITICAL FOR RISK OF FIRE AND ELECTRIC SHOCK. (constant linear velocity)
REPLACE THESE COMPONENTS WITH ONKYO PARTS Linear velocity: 1.2~1.4m/s

WHOSE PARTS NUMBERS APPEAR AS SHOWN IN THIS
MANUAL.

MAKE LEAKAGE-CURRENT OR RESISTANCE MEA-
SUREMENTS TO DETERMINE THAT EXPOSED PARTS
ARE ACCEPTABLY INSULATED FROM THE SUPPLY
CIRCUIT BEFORE RETURNING THE APPLIANCE TO
THE CUSTOM ER.

(ONKYO
Alllllll BflMPllNlNIS

Cross interleave readsolomon code
16 bits linear
88i2kHz (two-times oversampling)

Error correction system:
Decoded bits:
Sampling frequency:

Number ofchannels: 2 (Stereo)
Frequency response: SHz~20kHz
Total harmonic distortion: 0.03% (at IkHz)
Dynamic range: 93dB

Signal to noise ratio: 96dB

Channel separation:
Wow and Flutter:

Power comsumption:
Output level:
Dimensions (W x H x D):

90dB (at IkHZ)

Below threshold of measurability
14 watts

2 volts r.m.si

435 x 92 x 359mm

17»1/8 x 3-5/8 x 14-1/8"
Weight: 4.8kg, 10.61bs.

Specifications are subject to change without notice.

Page 2

TABLE OF CONTENTS

Specifications ............................ 1
Service procedures ......................... 2
Note on compact disc ....................... 3
Protection of eyes from laser beam .............. 4
Laser warning label ......................... 4
Caution on replacement of pick-up .............. 6
Packing view ............................. 7
Exploded view ............................ 8
Parts list ................................ 9
Mechanism exploded view ................... 10
Parts list ............................... 11
Disassembling procedures .................... 12
Trouble shooting guide ..................... 14
IC descripions ........................... 15
Adjustment procedures ..................... 22
Pc board view from bottom side ............... 25
Schematic diagram ........................ 27
Pc board-parts list ......................... 29
Block diagram ........................... 31

SERVICE PROCEDURES

1. Removing the Locking Plate

Locking plate is located on the bottom panel of this unit.
Before using this unit for the first time, the plate must be
removed. If power is switched on while this part is still in
place, the unit will not operate properly

1. Locking plate
2. Tapping screw

GD
GE)

Fig. 1

2. Safety-check out (U.S.A. model)

After correcting the original service problem, perform the
following safety check before releasing the set to the
customer:

Connect the insulating-resistance tester between the plug
of power supply cable and chassis.

Specifications: more than 10Mohm at 500V.

3. Procedures for replacement of flat packaged ICs
1. Tools to be used:
(1) Soldering iron Grounded soldering iron or
soldering iron with leak re-
sistance of 10 Mohms or

more.

Form of soldering irons tip:

(2) Magnifying glass . .. for checking of finished

works

(3) Tweezers ........ for handling of IC and
forming of leads

(4) Groundingring . . . . Countermeasure for electror
static breakdown

(5) Nipper ......... for removing defective 1C

(6) Small brush ...... for application of flux

2. Work Procedures:

(1) Remove the defective [C
Cut all leads of the defective IC one by one using
a nipper and remove the IC,

(2) Clean the pattern surface of the PC board.
Get rid of the remaining leads and solder.

(3) Check and from the leads of the new flat pack-
aged [C to be installed.
From every lead on the new lC using a pair of
tweezers, so that all of them are aligned neatly
without being risen, twisted or inclined toward
one side. Especially the rising portion of every
lead must be formed with greatest care.

|c SE IC g 3 IC é/
(Rising) (Twisting) (lncliningl

Fig. 3

(4) Apply flux to the PC board.

Apply flux to the pattern surface of the PC board
which has been cleaned, as shown in the illustration.
The area to be applied with flux is the portion of
about 2.5mm in width where the lCs leads are to
be soldered.

Be careful to apply minimum amount of flux
required so as not to smear it on unwanted areas.

as

About 2.5 mm

Fig. 4

Page 20

330

Connection of Micro Computer

DTCHANGE voo
- I 42
SYN REC 2 4. SCK
5-0 D IN
FLUORESCENT - 3 40 0202
TUBE LED 4 39 SI D OUT
SIGNAL
_ G | R/ W
ID 5 38 PROCESSOR
|_|" GZ REMOCON
-- 63 6 37 STOP 8
D: a; 7 36* CONTROLLER
CU -- e 35 we « _
56
l_I:I _ 9 VHH
67 RST
CD « I0 33-.--i 0222 } +5v
U3 63 q I 32- RESET 0402
69 X|(C|ock In M) MICROCOMPUTER
CD MUTE I2 3! w-from 0&2 . FOR REMOCON
TEST
To 030I(Muving Drive Circuit) -~ IS 30 - I
LSR KEY I
To 0|03(APC circuit) FOEEN I4 29 " .KEY MATRIX
022l I5 28 KEY} OPERATION
fig? TRAY MOTOR CLOSE KEY 3
DRIVER -" I6 27 KEY
0 KEY 4
1 -- IT 26 *- MECHANISM SWICH
b 9 -
, b --- I8 25
9 -~° 19 24 '
DP
e l 'c d TV 20 23 °
ss
-- - 2| 22 d
a 9 GND
To Segment -1 1_____
Terminals o! g 1-_-
Fluorescent -°~
Tube

_20_

Page 24

DX-330

7. Optical coupling adjustment

Connect the oscilloscope to test point DATA.

Tum R301 to minimum position (counter-clockwise).

Load the test disc (YEDS-18) and play back the track 2.
Adjust R301 so that a point of inter section of waveform
DATA becomes 2.5V.

2.5V

iGND

0.1us/div.
1V/div.

Photo 5

DATA
fl

P208

0301

DAG
[El
@9217 I
I:H¥f::}

P206

00
GE

P901

P102
F101

Adjustment Point

-24_

Page 31

DX-330
DX-220

2. Tracking servo

This control circuit moves the objective lens radially
to keep the laser beam precisely centered in the tracks
on the disc surface (which are only 1.6;Lm wide).

1,
r k 5 Tracking Tracking
vac mg R273 onset 93m
error slgnal adyuslmenl adjustment
7, E 52:1 P RZOOI
_ :- K
Opiical pickup 2° W .922: R235 R260 R262
KsS-i23A (5) (4) .w x F + -vw-
4 E 72.2.15 L c245
227 "r _____
,-1 c225 {- _ +
E R275 l l- l Driver
13 R207 R274 R27| r-1 0217 /
F R2,, + l7 u L A;, is R267 I
IS I I .w 7 R259
6
225 R270
R273 l L- - J
I l
1
R279 } I
l_ _____
l
L-..

Tracking
balance
amustmem

Tracking call

no PIOZ

Tracking drive output

FEOF

A

R297
TROF ----MI--

R279 R285

2
0245

Fig-3

2-1. Tracking Error Sensor
This unit uses a three-beam laser pickup. The error
signal is obtained from the difference between the E
and F output from both sides of a four-section
photodiode housed in the pickup

T.E. (tracking error) = F - E
The E and F signals are input into pins 18 and 19 of
Q20], the difference is obtained by an internal opamp,
and the T.E. signal is output from pin 17.

2-2. Phase Correctors - Drivers

The tracking error signal is relayed from Q20] pin 17
to pins 16, 15. 7 and 6 in succession. After passing
through drivers Q217 and 0218 it drives the tracking
coil of the pickup. C226. C249. C225 and C224 are
capacitors which perform phase corrections. Balance,
offset and gain are regulated by semi-fixed resistors
R279. R273 and R269 respectively.

The switches incorporated in pins 12 and 13 of 0201
turn the servo on and off and switch the high frequency
range loop gain on and off. thereby helping to stabilize
transient operation during access times. The timing of

these switches is determined by the input into pins 9
- 11 of 0201. The commands are as follows:
TROF (tracking OFF) FEOF (feed OFF)
TRGL (tracking gain low) TRHD (tracking high
down)
Signals are output from 0202 in response to commands
from microprocessor 0204.

2-3. TER circuit

The TER signal is one of the sensors that determines
the switch timing mentioned above. It is produced by
running the tracking error signal output from pin 15
through a comparator at the ground level and then
output through pin 14