Onkyo DX 200 Service Manual

Page 1

DX-200

ERIAL NO. 3211

ONKYO® SERVICE MANUAL

COMPACT DISC PLAYER
MODEL DX-200

UDN, UD I20V AC, 60HZ
UGV, UG 220V AC, SOHZ
UW IZO/ZZOV AC, 50/60HZ
UOA, UQB 240V AC, SOHZ
SAFETY-RELATED COMPONENT WARNING SPECIFICATIONS
COMPONENTS IDENTIFIED BY MARK A ON THE Type; Compact Disc player Wm,
SCHEMATIC DIAGRAM AND IN THE PARTS LIST ARE optical pickup
CRITICAL FOR RISK OF FIRE AND ELECTRIC SHOCK. Quantization: 16 bit linear
REPLACE THESE COMPONENTS WITH ONKYO PARTS Channels 2 (Stereo)
WHOSE PARTS NUMBERS APPEAR AS SHOWN IN THIS Frequency response: 2H2 ~ ZOkHz 20.5dB
MANUAL, Dynamic range. Over 96dB
Total harmonic distortion: 0.003% (lkHz)
MAKE LEAKAGE-CURRENT OR RESISTANCE MEA- Channel separation 93 dB at IkHz
SUREMENTS TO DETERMINE THAT EXPOSED PARTS S/N ratio: Over 96dB
ARE ACCEPTABLY INSULATED FROM THE SUPPLY Wow and flutter: Unmeasurable
CIRCUIT BEFORE RETURNING THE APPLIANCE TO Output 2 Ovolts
THE CUSTOMER. Pleup: Semiconductor laser lype
Power Consumption: 21 watts
Dimensions: 435 (W) x 102 (H) x 350 (D) mm
Weight: 60kg
Accessories. Connecuon cables

Instruction manual

Remote control

Specifications are subJect to change without notice.

ONKYO®
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Page 2

DX-200

TABLE OF CONTENTS

Specifications .......................... 1
Precautions .............................. 2
Note on compact disc ....................... 3
Protection of eyes from laser beam during servicing. . . . 4
Laser warning labels ........................ 4
Cautions on replacement of pick-up .............. 6
Packing View ............................ 7
Adjustment procedures ...................... 8
Exploded View ........................... l 1
Mechanism exploded View ................... 13
Parts list .............................. 14
PC board view/parts list .................... 16

Preamp/Headphone/Switches _ . , , , ......... 16

Display/Power/Output/Indicator .............. 17

Function swttch ......................... 18

Main circuit ............................ 19

PRECAUTIONS

l. Removing the Transport Screws and Locking Plate
Three transport screws and locking plate are located on
the bottom panel of this unit. Before usmg this unit for
the first time, these screws and the plate must be removed.
If power is switched on while thses parts are Still in place,
the unit will not operate properly.
Note: For safe keeping, insert the short end of the locking
plate back in the slot and replace the screw to hold
the plate in place.

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Spacer L
P.N.27270169 _ gig/l locking mm
Fig.1 ©P,N_27141023

2. Safety-check out (U.S.A. model)

After correcting the original service problem, perform the
following safety check before releasing the set to the
customer

Connect the insulating-rESistance tester between the plug
of power supply cable and chassis.

Specifications: more than lOMohrn at 500V,

3. Replacing the fuses

For continued protection against fire hazard, replace only
with same type and same rating fuse.

Circuit no. Part no. Description

F801 252063 500mA-EAWK, Primary (G/Q models)
F802 252063 SOOmA-EAWK, Primary (W model)
F801 252045 1A (ST-6), Primary (D/W models)

4. Procedures for replacement of flat packaged le
1. Tools to be used:
(1) Soldering iron . Grounded soldering iron or

soldering iron with leak re-
sistance of 10 Mohms or

171018.

Form of soldering irons tip:

(2) Magnifying glass . .. for checking of finished

works

(3) Tweezers ........ for handling of 1C and
forming of leads

(4) Grounding ring. . . . Countermeasure for electro-
static breakdown

(5) Nipper ......... for removing defective 1C

(6) Small brush ...... for application oftlux

2, Work Procedures:

(1) Remove the defective 1C
Cut all leads of the defective IC one by one using
a nipper and remove the 1C.

(2) Clean the pattern surface of the PC board.
Get rid of the remaining leads and solder.

(3) Check and from the leads of the new flat pack-
aged [C to be installed.
From every lead on the new 1C using a pair of
tweezers, so that all of them are aligned neatly
Without being risen, twisted or inclined toward
one side. Especially the rising portion of every
lead must be formed With greatest care.

it: // \ IC ../ ic //
/
g 1/E \:\

(Rising) [Twisting] (inclining)

Fig. 3

(4) Apply flux to the PC board.

Apply flux to the pattern surface of the PC board
which has been cleaned, as shown in the illustration,
The area to be applied with flux is the portion of
about 2.5mm in width where the [Cs leads are to
be soldered.

Be careful to apply minimum amount of flux
required so as not to smear it on unwanted areas.

About 2.5 mm