Harman kardon pm 640 service manual

Page 1

The Harman Kardon

r Model HK640/HK660 Mammal
INTEGRATED AMPLIFIER

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The following marks found in the parts list of this manual
identify the models as follows:
fl HK640/HK660 13: International model Black version
HK640/HK660 0: International model

HK640 w : Asia/Oceania model Black version

CONTENTS

SPECIFICATIONS ......................... .. 2 IC BLOCK DIAGRAM .....
DISASSEMBLY PROCEDURES -- 2 WIRING DIAGRAM
CONTROLS AND FUNCTIONS .. 3 SCHEMATIC DIAGRAM
POWER CORD REPLACEMENT -- 3 PHGOO PHONO P.C. BOARD OPTION
ALIGNMENT PROCEDURES . .. 3 How To INSTALL ..................................... 19
BLOCK DIAGRAM -------------------- -- 3 GENERAL UNIT PARTS LIST
GENERAL UNIT EXPLODED VIEW .. 4 PC. BOARD ----------------------
GENERAL UNIT PARTS LIST ~- 5 WIRING DIAGRAM
P.C. BOARDS -------------------- - 5 SCHEMATIC DIAGRAM
ELECTRICAL PARTS LIST - -- 7 ELECTRICAL PARTS LIST
IC TERMINAL FUNCTION ----- 13
harman/kardon

Parts and Service Office
80 Crossways Park West. Woodbury. NY. 11797
1112-HK640-A A9502 300 Printed in Japan

Page 2

HK640
HK660

SPECIFICATIONS
Nominal Limit
RMS Output Power
8 Q. 1kHz THD 0.1% 62.3w a 55W (Model: HKSMJ)
B [2, 1kHz THD 0.1% 75.6w g 65W (Model: HKSBD)
4 £2, 1kHz THD 0.3% 91.2w g 75W (Model: HKS40)
4 S2, 1kHz THD 0.3% 117.2w a 90W (Model: HK660)
High-instantaneous Current
Capability (HCC) 40A g 35A (Model: HK640)
38.4A g 35A (Model: HKSSO)
Half Power Bandwidth
(THD 0.1 %) <1 OHz-BEKHZ <1OHZ-70kHz (Model: HK640)

<1 OHz-BflkHz <1 OHz-70kHZ (Model: HKSSO)

Frequency Response

(at -3dB down) 0.17H2105kHZ <1Hz- g QOkHz (Model: HK640)

0,20Hz-108kHz <1H2- g QOkHz (Model: HK660)
Input Sensitivity

(at 55W output) Tuner/CD: 14DmV >140mV :I: 25mV/17k9 :t BKQ

Option Phono (MM): 2.4mV/49kohm
Option Phono (MC): 131 )N/ESQ
Signal to Noise Ratio
Tuner/CD: 84.0dB ; 74dB (Model: RK640)
asses e 74dB (Model: HK660)
Option Phono (MM): 79dB
Option Phono (MC): 75dB

Channel Separation (at 10kHz) 60.0dB ; 45dB

Option Phono (MM): GSdB
Option Phono (MC): GSdB
IM Distortion Ratio (at 1W): 0.027% 5 0.1%

DISASSEMBLY PROCEDURES (REFER TO PAGES

III CABINET TOP (131) REMOVAL

Remove 6 screws (A) and then remove the Cabinet
Top (131).

El FRONT PANEL ASSV (AA) REMOVAL
1. Remove the Cabinet Top (131), referring to the pre-
vious step m.

. Pull out 3 Rotary Knobs (151).

. Remove 5 screws (8) and then remove the Front
Panel Assy (AA).

MAIN P.C. BOARD (PCB-1) REMOVAL

Remove the Front Panel Assy (AA), referring to the

previous step (1|.

2. Disconnect the Connector (CWTOS) from 1 Connector
(CN703) on the CPU P.C. Board (PCB-5).

3. Pull out the Rotary Knob (150) and 2 Push Buttons
(146).

4. Disconnect the 3 Connectors (JL501. CW704 and
W-502) from 3 Connectors (CN502, CN704 and CN503)
on the VR P.C. Board (PCB-10).

5. Disconnect the Jumper Lead (JL702) from Connector
(CN702B) on the Main P.C. Board (PCB-1).

6. Remove 3 hexagon nuts (C).

7. Remove 4 screws (D) and then remove the Metal Fit-
ting (166).

8. Remove 8 screws (E) and then remove the Chassis
(161) with CPU P.C. Board (PCB-5), Power LED P.C.
Board (PCB-7), VR P.C. Board (PCB-10) and SP SW
P.C. Board (PCB-2).

9. Remove 13 screws (F) and then remove the Main P.C.

Board (PCB-1).

If necessary unsolder the lead wire.

CPU P.C. BOARD (PCB-5) REMOVAL

1. Remove the Cabinet Top (131), referring to the pre-
vious step m.

2. Disconnect the Jumper Lead (JL702) from Connector
(CN702A) on the CPU P.C. Board (PCB-5).

3. Disconnect the Connector (CW703) from Connector
(CN703) on the CPU P.C. Board (PCB-5).

4. Disconnect the Connector (CW282) from Connector
(CN282) on the l/O P.C. Board (PCB-6).

5. Remove 5 screws (G) and then remove CPU P.C.

Board (PCB-5).

if necessary unsolder the lead wire.

UM

Nominal Limit
Damping Factor (at 1H2): 94.3 e 85 (Model: HK640)
90.1 a 85 (Model: HK660)
Phone-Overload
Option Phono (MM): 109mV
Option Phono (MC): 5.6mV
Tone Control Characteristics
Bass (at 50Hz) Boost 10dB :l: 2dB
Cut tfldB i 2118
Treble (at 1DkHZ) Boost 10dB t 2115
Cut 10:13 i 2115
DC Output Voltage (at 69)
L channel OmV i 60mV
R channel DmV i SDmV
Idling current (at 89) 75mA : SmA
Dimensions 17.4' X 5.3 X 14.1 " (Model: HK640)
(W X H X D) (443 X 134 X 359 mm)
17.4 X 5.3' X 14.4' (Model: HK660)
[443 X 134 X 366 mm)
Weight 19.4 lbs./B.Bkg (Model: HK640)

21 .e lbs./9.8kg
AC 230v. 50/5011:
230w
240W

(Model: HKGBO)
Power Supply
Power Consumption (Model: HK64D)

(Model: HKGGD)

These specifications are service target specs.

Specifications and components are subject to change without notice.
Overall performance will be maintained or Improved.

4ANDIS)

El VOLUME P.C. BOARD (PCB-10) REMOVAL

1. Remove the Front Panel Ass'y (AA). referring to the
previous step E. '

2. Disconnect the Connector (CW703) from Connector
(CN703) on the CPU P.C. Board (PCB-5).

3. Disconnect 3 Connectors (JL501. CW704 and W-502)
from 3 Connectors (CN502, CN704 and CN5oa) on
the Volume P.C. Board (PCB-1D).

4. Remove hexagon nut (H) and then remove the Volume
P.C. Board (PCB-10).

L-6_I IIO P.C. BOARD (PCB-e) REMOVAL

1. Remove the Cabinet Top (131), referring to the pre-
vious step El

2. Remove 2 screws (l) and then remove SP Terminal
P.C. Board (PCB-4).

3. Disconnect 2 Connectors (CW281 and CW282) from 2
Connectors (CN281 and CN282) on the l/O P.C. Board
(PCB-6).

4. Remove 2 screws (J) and then remove l/O P.C. Board
(PCB-6).

OPTION PHONO P.C. BOARD (PCB-101) REMOVAL

1. Remove the Cabinet Top (131), referring to the pre-
vious step III.

2. Remove 1 revet (K) and 4 screws (D) and then remove
the Metal Fitting (166).

3. Remove 1 screw(199) and then disconnect 2 Connec-
tors (CWGOZ and W601) from 2 Connectors (CN102
and CN101)on the Main P.C. Board (PCB-1).