Harman kardon avr 110

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harman/kardon

AV II

A/V DOLBY DIG TAL RECEIVER

SERVICE MANUAL

.IIII'. |I.'.' .--w. m «.
Hint-111"-

ESD WARNING ..................................... 2
LEAKAGE TESTING .....
BASIC SPECIFICATIONS...
FRONT PANEL CONTROLS

REAR PANEL CONNECTIONS ........ ...9
REMOTE CONTROL FUNCTIONS... ..... 11
TROUBLESHOOTING GUIDE .............. 14
PROCESSOR RESET ........................... 14
IDLE CURRENT/TUNER ALIGNMENT ...... 15
BULLETIN # H/K2001-O1 ....................... 16
BULLETIN # H/K2001-O3..

BULLETIN # H/K2003-O7 ....................... 19

CONTENTS

TECH TIP# HKTT2002-O1 ..................... 21
TECH TIP# HKTT2003-O1.. ..... 23
UNIT EXPLODED VIEW ............... 24
EXPLODED VIEW PARTS LIST. ....25
BLOCK DIAGRAMS.... ..... 26
PCB DRAWINGS ................ ...28
ELECTRICAL PARTS LIST ...... ..40
SEMICONDUCTOR PINOUTS.. ..... 61

SCHEMATICS ....................... ..109
WIRING DIAGRAM. ....124
PACKAGE ........................................ 127

harman/kardon, Inc.

250 Crossways Park Dr.
Woodbury, New York 11797 Rev2 - 6/2005

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AVRI IO harman/kardon

ELECTROSTATICALLY SENSITIVE (ES) DEVICES

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and
semiconductor chip components

The following techniques should be used to help reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductoreequipped assembly, drain off any electrostatic charge on
your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to
prevent electrostatic charge buildeup or exposure of the assembly.

3. Use only a groundedetip soldering iron to solder or unsolder ES devices.

4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges
sufficient to damage ES devices.

5. Do not use freonepropelled chemicals These can generate electrical change sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement
ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material.)

7, Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the
chassis or circuit assembly into which the device will be installed.

CAUTION : Be sure no power is applied to the chassis or circuit, and obsen/e all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together

or your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricity sufficient to damage an E8 devices

PRODUCT SAFETY NOTICE

Each precaution in this manual should be followed during servicing.

Components identified with the IEC symbol A in the parts iist are special significance to safety. When replacing a component identified with
A, use only the replacement parts designated, or parts with the same ratings or resistance, wattage, or voltage that are designated in the
parts list in this manual. Leakageecurrent or resistance measurements must be made to determine that exposed parts are acceptably

insulated from the supply circuit before returning the product to the customer.