Harman kardon adp 303 service manual

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The Harman Kardon
MOdEI ADP303 ManualA
DOLBY DIGITAL DECODER

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The following marks found in the parts list of this manual
Identify the models as follows.

3 ADP303 :Norlh Amerlca area model Black version

3 ADP303 :lnternallonal model Black version

CONTENTS

SPECIFICATIONS ....................................................... 2 GENERAL UNIT PARTS LIST .....
ELECTROSTATICALLY SENSITIVE (ES)DEV|CE 2 DISASSEMBLY PROCEDURES..
LEAKAGE TEST P.C. BOARDS ...............................
CONTROLS AND F ELECTRICAL PARTS LIST ..
TECHNICAL DESCRIPTION ........ IC BLOCK DIAGRAMS ......
SIGNAL AND CIRCUIT DESCRIPTION .. SCHEMATIC DIAGRAMS
BLOCK DIAGRAM AND WIRING ........ PIN CONNECTION DIAGRAM .....
GENERAL UNIT EXPLODED VIEW.... PACKING MATERIAL ...................

harman/kardon

Parts and Service Office I
80 Crossways Park Wesl, Woodbury. N.Yr 11797 I
1112-ADP303 500 Printed in Japan I
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- ADP303 .

SPECIFICATIONS
Output Level/Output Impedance Total Harmonic Distortion
MAIN L/R, CENTER, SURROUND L/R MAIN L/R, CENTER, SURROUND L/R (1 KHZ) 0.01% or less
1 KHz, 0 dB INPUT 0-3.5 V / 500 D SUBWOOFER (50 HZ) 0.1% or less
SUBWOOFER Signal to Noise Ratio ( IHFvA) 98 dB , ..
50 Hz, 0 dB INPUT 0~9 V / 500 (2 Channel Separation ( 1 KHz) 80 dB <
Input Impedance ( RF, COAXIAL ) 75 (1 Power Consumption 30 W
AC OUTLET : UNSWITCHED 200 W max.
Frequency Response Dimensions (W/H/D) 17-3/8 In x 33/8 in x 11 in
MAIN L/R, CENTER, SURROUND L/R ( LARGE) 441 mm X 85 mm x 279 mm(MAX)
20 Hz-20 KHz 20.5 dB Weight 9.4 lbs. (4.2 kg. )
Filter characteristics
MAIN L/R, CENTER, SURROUND L/R (SMALL)
H.P.F. fc=100 Hz, 12 dB/ocl. .
SUBWOOFER Specifications and components are subiect to change without
LPF ic=100 Hz, 24 dB/oct. notice. Overall performance will be maintained or improved.

Note : "RESET" operation is necessary to initialize the microprocessor (QL01) after every repair.
"RESET procedures is follow.

Short "B-RST" terminals on the side-B of PCB (P604) for a couple of seconds.

Manufactured under license from Dolby Laboratories Licensing Corporation. "Dolby', "AC-3", and the double-D
symbol are trademarks of Dolby Laboratories Licensing Corporation. Copyright 1992 Dolby Laboratories, Inc. All
rights reserved.

Dolby", "AC-3" and the double-D symbol are trademarks oi Dolby Laboratories Licensing Corporation.

ELECTROSTATICALLY SENSITIVE (ES) DEVICES

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly {
are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some

field effect transistors and semiconductor "chip" components. The following techniques should be used to help

reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.

2. Alter removing an electrical assembly equipped with E3 devices, place the assembly on a conductive surface («1.5
such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical change sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to
install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive
foam, aluminum foil or comparable conductive material.)
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit. and observe all other safety precautions. (

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion
such as the brushing together or your clothes fabric or the lifting of your foot from a carpeted floor can generate
static electricity sufficient to damage an E8 device.)