Fisher 304 X 314 Service Manual

Page 1

PRlCE $2.00

SERVICE MANUAL

The Fishen

304x

314

JM-JW
2/4-Channel Convertible
Stereo Receiver ,

WORLD LEADER IN HIGH QUALITY STEREO

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TEST EQUIPMENT and SERVICE TIPS

The following equipment is required to completely test and align the Receiver:

Line Voltage Autotransformer or Voltage Regulator

DC Vacuum Tube Voltohmmeter

Accurately Calibrated AC Vacuum Tube Voltrneter
Oscilloscope (Flat to 100 kHz Minimum)
Low»Distortion Audio Sine-Wave Generator

Harmonic Distortion Analyzer

4 Load Resistors, 4-Ohms, 250 Watts (Minimum Rating)

Colon-o

Low-Distortion AMAFM Signal Generator

10.7 MHz Sweep Generator (Fisher 3024*)

Multiplex Generator (Fisher 1536)

455 kHz Sweep Generator (Fisher 3025*)

Soldering Iron with Small Tip, Fully Insulated from AC Line
Suction Desoldering Tool

Sound Source and Speakers for Listening Tests

Requires Power Supply (Fisher 1561)

CAUTION:

This precision high-fidelity instrument should be serviced only by qualified personnel,
trained in the repair of transistor equipment and printed circuitry.

Many of these items are included only as a reminder - they
are normal procedures for experienced technicians. Shortcuts
may be taken. but these often cause additional damage to
transistors, circuit components. or printed circuit boards.

SOLDERING: A well-tinned, hot, clean soldering iron tip
will make soldering easier, without causing damage to the
printed circuit board or the components mounted on it.
Regular use of a sponge cleaner will maintain a clean
soldering surface. The heat available at the tip, (not the watt<
age of the iron) is important. Some 50-watt irons reach tem-
peratures of 1.0009 F, while others will hardly melt solder.
Small-diameter tips should be used for single solder con-
nections, pyramid and chisel tips for large areas.

Always disconnect the AC power cord from the line when
soldering. Turning the power switch OFF is not sufficient.
Power-line leakage paths, through the heating elements of the
iron, may destroy transistors.

PARTS REMOVAL: If a part is not being returned for in-
warranty factory replacement, it may be cut in half (with
diagonal cutting pliers) to make removal easier. Multiple
terminal parts, such as IF transformers, or electrolytic capaci»
tors, should be removed using special die-soldering tips made
especially for this purpose. Removing solder from terminals,
reduces the possibility of breaking the printed circuit board
when the part is removed.

ACCIDENTAL SHORTS: A clean working area, free of metal
particles. screws, etc., is an important preventive in avoiding
servicing problems: Screws, removed from the chassis during
servicing, should be stored in a box until needed. While a set
is operating, it takes only an instant for a bonito-collector
short to destroy a transistor (and others direct-coupled to it).
In the time it takes for a dropped screw. washer, or screw-
driver, to contact a pair of terminals (or terminal and chassisl,
a transistor can be ruined.

SOLID-STATE DEVICES: Integrated Circuits contain the
equivalent of many circuit parts, including transistors, diodes,
resistors, and capacitors. The preferred troubleshooting pro-
cedure requires isolating the trouble to one stage using AC
signal tracing methods. Once the suspected stage is located
the DC voltages at the input and output leads are measured to
give an accurate indication of the operating conditions of the
IC. DO NOT use an ohrnmeter, to check continuity with the
IC mounted on the printed circuit board. Forward biasing the
internal junctions within the IC may burn out the transistors.
Do not replace a defective IC until all external resistors,
capacitors, and transformers are checked first, to prevent the
replacement II: from failing immediately due to a defect in
the connecting components. Solder and unsolder each lead
separately using a pliers or other heat sink on the lead to

prevent damage from excessive heat. Check that the leads are
connected to the correct locations on the printed circuit
board before turning the set on.

Whenever possible, a transistor tester should be used to de-
termine the condition of a transistor or diode. Ohmmeter
checks do not provide conclusive data, and many even de-
stroy the iunctionlsl within the device.

Never attempt to repair a transistor power amplifier module
until the power supply filtervcapacitors are fully discharged.

If an output or driver transistor becomes defective (opens or
shorts), always check ALL direct-coupled transistors and
diodes in that channel. In addition, check the bias pot., and
other parts in the bias network, belore installing replacement
transistors. All output and driver transistors in one channel
may be destroyed if the bias network is defective. After parts
replacement, check bias for specified idling current.

ln some applications, replacement of transistors must be
made from the same beta group as the original type. The
beta group is indicated bya colored marking on the transistor.
Include this information when ordering replacements.

When mounting a replacement power transistor, be sure the
bottom of the flange, mica insulator, and the surface of the
heat sink, are free of foreign matter. Dust and grit will pre-
vent flat contact, reducing heat transfer to the heat sink.
Metallic particles can puncture the insulator, cause a short.
and destroy the transistor.

Silicone grease must be used between the transistor and the
mica insulator and between the mica and the heat sink lor
best heat transfer. Use Dow-Corning DC-3, or an equivalent
compound made for power transistor heat conduction.

Use care when making connections to speakers and output
terminals. To reduce the possibility of shorts, lugs should be
used on the exposed ends, or stranded wire should be tinned
to prevent frayed wire ends. Current in the speakers and out-
put circuitry is quite high - pobr contacts, or small wire,
can cause significant power losses. For wire lengths greater
than 30 feet, 16 AWG, or heavier, should be used.

VOLTAGE MEASUREMENTS: All voltages are measured
with the line voltage adjusted to 120 volts. All measured
voltages are a 20%. DC voltages are measured to chassis
with a VTVM, with no signal input unless otherwise noted.
AC signal voltages are measured under the conditions speci-
fied on the schematic.

ALIGNMENT PROCEDURES: DO NOT attempt realignment
unless the required test equipment is available, and the align-
ment procedure is thoroughly understood.

® COPYRIGHT 1973 FISHER RADIO I All Rights Reserved.

Page 20

CD-4 ALIGNMENT

ITEM GENERATOR INDICATOR PROCEDURE
24. RIGHT SetupCD-4generatorout- AC VTVM to OUT Adjust RIGHT CD-4 SEPARATKW
CHANNEL puts as indicated in T0 RCDR FRONT control for lowest reading
SEPARATION Step 19. RIGHT jack on on VTVM.
TEST AND receiver rear
ALIGNMENT. panel.
25. Set CD-4 generator Chan- AC VTVM VTVM should indicate 500
nel Selector to FRONT mv: 120 mv. Record this
reading as 0 dB.
26. Set CD-4 Channel Selector AC VTVM VTVM should indicate at
to REAR. least 20 dB below 0 dB
reference of preceding
step.
27. AC VTVM to OUT VTVM should indicate 450
T0 RCDR REAR mV: 100 mV. Record this
RIGHT jack on reading as 0 dB.
receiver rear
panel.
28. SetCD-4 generator Chan- AC VTVM VTVM should indicate at

nel Selector to FRONT

CD-4 TEST EQUIPMENT

least 20 dB below 0 dB
reference of preceding
step.

The following equipment is required to completely test
and align the CD-4 demodulator:

Line Voltage Autotransformer or Voltage Regulator

DC Vacuum Tube Voltnhmmeter

Accurately Calibrated AC Vacuum Tube voltmeter

Oscilloscope

Low-Distortion Audio Oscillator

CD-4 Generator (Fisher 3109)

RCA shorting Plugs (2)

4-inch jumper with alligator clips

10 uF Electrolytic Capacitor

Soldering Iron with Small Tip, Fully Insulated from AC Line

Suction Desoldering Tool

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VCO WAVEFORM

REPLACING CD-MATIC 0R CD-4 LAMP

Unplug AC power cord and remove cabinet.

Remove lamp PCB by removing two scr '
ews securin it to the
front panel of the Demodulator. 9

Gently pull back the lamp PCB until the lamps clear the
holes in the plastic lamp housings.

Unsolder and remove defective lamp

and solder re
lamp 0 lamp PCB. placement