Bose l1 i system
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2 Contents Safety Information........................................................................\ ..................................... ........................................ 3 Specifications ........................................................................\ ................................................................................ 4-5 Differences between the PS1 Power Stand and the L1 ® Model I Power Stand ............................................ 6 Electrostatic Discharge Sensitive (ESDS) Device Handling ....................................................................... ........... 6 Warranty ........................................................................\ ............................................................................................. 6 Part List Notes ........................................................................\ ........................................ ........................................... 6 Packaging Part List, L1 Model I Power Stand (see Figure 1) ..................................................................... ............ 7 Figure 1. L1 Model I Power Stand Packaging View ........................................................................\ ........ .....................8 Packaging Part List, L1 Model I Line Array (see Figure 2) ...................................................................... ............... 9 Figure 2. L1 Model I Line Array Packaging View ........................................................................\ ......... ........................9 Packaging Part List, B1 Bass Module (see Figure 3) ........................................................................\ ..... .............. 10 Figure 3. B1 Bass Module Packaging View ........................................................................\ ................ .......................10 Main Part List, L1 Model I Power Stand (see Figure 4) ........................................................................\ .. .............. 11 Figure 4. L1 Model I Power Stand Exploded View ........................................................................\ ......... ....................12 Main Part List, L1 Model I Power Box (see Figure 5) ........................................................................\ .... ............... 13 Figure 5. L1 Model I Power Box Exploded View ........................................................................\ ........... ....................13 Main Part List, L1 Model I Input Panel Assembly (see Figure 6) ................................................................. ........ 14 Figure 6. L1 Model I Input Panel Assembly Exploded View ........................................................................\ ..............15 Main Part List, Remote Control Assembly (see Figure 7) ........................................................................\ . ........... 16 Figure 7. Remote Control Assembly Exploded View ........................................................................\ ........ .................16 Main Part List, L1 Model I Upper and Lower Line Source Arrays (see Figure 8) ............................................... 17 Figure 8. L1 Model I Line Array Exploded View ........................................................................\ .......... .......................18 Main Part List, B1 Bass Module Exploded View (see Figure 9) .................................................................... ....... 19 Figure 9. B1 Bass Module Exploded View ........................................................................\ ................. .......................19 Electrical Part Lists ........................................................................\ .................................. .................................20-69 Input Panel PCB Assembly........................................................................\ ............................... ........................20-29 Digital Signal Processor (DSP) PCB Assembly ........................................................................\ ............ .......... 30-36 Microprocessor (MCU) PCB Assembly ........................................................................\ ...................... ..............37-40 Amplifier PCB Assembly, Part Number 306282 ........................................................................\ ............. .......... 41-47 Amplifier PCB Assembly, Part Number 312945 ........................................................................\ ............. .......... 48-52 27 Volt Switch-Mode Power Supply PCB Assembly ........................................................................\ .......... ..... 53-57 Auxiliary Power Supply PCB Assembly ........................................................................\ .................... ..............58-63 FCC Filter PCB Assembly ........................................................................\ ......................................................... 64-66 Remote Control PCB Assembly ........................................................................\ ............................ ...................67-69 Figure 10. L1 Model I Power Stand Electronics Module with Top Cover Removed ................................................... 70 Disassembly Procedures ........................................................................\ ................................. .........................71-77 Figure 11. L1 Model I Power Stand Block Diagram ........................................................................\ ........ ...................78 Test Procedures ........................................................................\ ........................................ ................................79-85 Figure 12. Amplifier Output Test Cable Wiring Diagram ........................................................................\ .. ..................86 L1 Model I Power Stand Software Update Procedure ........................................................................\ ....... ........... 90 Theory of Operation ........................................................................\ ................................................................. 91-111 Schematic Diagrams ........................................................................\ ............................................................ 1 12-133 Line Array Wiring Diagram ........................................................................\ ....................................................... . 134 Figure 13. EMI (FCC) Filter PCB Assembly Board Layout ........................................................................\ .. .........135 Figure 14. +/-27V SMPS PCB Assembly Board Layout ........................................................................\ ....... ........135 Figure 15. Auxiliary P/S PCB Assembly Board Layout ........................................................................\ ..... ...........135 Figure 16. Input Panel PCB Assembly Top Etch Board Layout ...................................................................... ......136 Figure 17. Input Panel PCB Assembly Bottom Etch Board Layout ................................................................... ..136 Figure 18. DSP PCB Assembly Top Etch Board Layout ........................................................................\ ...... ........137 Figure 19. DSP PCB Assembly Bottom Etch Board Layout ........................................................................\ ... .....137 Figure 20. MCU PCB Assembly Top Etch Board Layout ........................................................................\ ...... ........138 Figure 22. Remote Control PCB Assembly Top Etch Board Layout ................................................................... ..138 Figure 21. MCU PCB Assembly Bottom Etch Board Layout ........................................................................\ ... .....138 Figure 23. Remote Control PCB Assembly Bottom Etch Board Layout .............................................................. 138 Figure 24. Class-D Amplifier PCB Assembly, P/N: 306282, Top Etch Layout ..................................................... 139 Figure 25. Class-D Amplifier PCB Assembly, P/N: 306282, Bottom Etch Layout ............................................... 139 Figure 26. Class-D Amplifier PCB Assembly, P/N: 312945, Top Etch Layout ..................................................... 140 Figure 27. Class-D Amplifier PCB Assembly, P/N: 312945, Bottom Etch Layout ............................................... 140 IC Diagrams ........................................................................\ ............................................ ...............................141-153 Service Manual Revision History ........................................................................\ ........................ ...................... 154
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3 Safety Information 1. Parts that have special safety characteristics are identified by the symbol on schematics or by special notes on the parts list. Use only replacement parts that have critical characteristics recommended by the manufacturer. 2. Make leakage current or resistance measurements to determine that exposed parts are acceptably insulated from the supply circuit before returning the unit to the customer. Use the following checks to perform these measurements: A. Leakage Current Hot Check-With the unit completely reassembled, plug the AC line cord directly into a 120V AC outlet. (Do not use an isolation transformer during this test.) Use a leakage current tester or a metering system that complies with American National Standards Institute (ANSI) C101.1 "Leakage Current for Appliances" and Underwriters Laboratories (UL) 6500 / IEC 60056 paragraph 9.1.1. With the unit AC switch first in the ON position and then in OFF position, measure from a known earth ground (metal waterpipe, conduit, etc.) to all ex- posed metal parts of the unit (antennas, handle bracket, metal cabinet, screwheads, metallic overlays, control shafts, etc.), especially any exposed metal parts that offer an electrical return path to the chassis. Any current measured must not exceed 0.5 milliamp. Reverse the unit power cord plug in the outlet and repeat test. ANY MEASUREMENTS NOT WITHIN THE LIMITS SPECIFIED HEREIN INDICATE A POTENTIAL SHOCK HAZARD THAT MUST BE ELIMINATED BEFORE RETURNING THE UNIT TO THE CUSTOMER. B. Insulation Resistance Test Cold Check-(1) Unplug the power supply and connect a jumper wire between the two prongs of the plug. (2) Turn on the power switch of the unit. (3) Measure the resistance with an ohmmeter between the jumpered AC plug and each exposed metallic cabinet part on the unit. When testing 3 wire products, the resistance measured to the product enclosure should be between 2 and infinite MOhms. Also, the resistance measured to exposed input/output connectors should be between 4 and infinite MOhms. When testing 2 wire prod- ucts, the resistance measured to exposed input/output connectors should be between 4 and infinite MOhms. If it is not within the limits specified, there is the possibility of a shock hazard, and the unit must be repaired and rechecked before it is returned to the customer. CAUTION: The Bose ® L1 ® Model I System contains no user-serviceable parts. To pre- vent warranty infractions, refer servicing to warranty service stations or factory service. PROPRIETARY INFORMATION THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION OF BOSE CORPORATION WHICH IS BEING FURNISHED ONLY FOR THE PURPOSE OF SERVICING THE IDENTIFIED BOSE PRODUCT BY AN AUTHORIZED BOSE SERVICE CENTER OR OWNER OF THE BOSE PRODUCT, AND SHALL NOT BE REPRODUCED OR USED FOR ANY OTHER PURPOSE.