Bose l1 bose model ii system rev 01

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bose l1 bose model ii system rev 01

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2 Contents Safety Information ............................................................................................................................. 3 Warranty ............................................................................................................................................. 3 Specifications ................................................................................................................................ 4-5 Electrostatic Discharge Sensitive (ESDS) Device Handling ......................................................... 5 Part List Notes ................................................................................................................................... 5 Product Description ...................................................................................................................... 6-9 System Components ........................................................................................................................ 6 Setting up the L1 ® model II power stand ........................................................................................ 7 Assembling the L1 model II Cylindrical Radiator ® loudspeaker ................................................... 7 Connecting the B1 bass module ..................................................................................................... 8 L1 Model II Power Stand Input and Output Connectors, Controls ............................................... 8 Setting the Analog Input Level on the L1 Model II Power Stand .................................................. 9 Adding a T1 ToneMatch ® audio engine ........................................................................................... 9 Packaging Part List, L1 Model II Power Stand (see Figure 1) ..................................................... 10 Figure 1. L1 Model II Power Stand Packaging View .........................................................................10 Packaging Part List, L1 Model II Line Array (see Figure 2) ......................................................... 11 Figure 2. L1 Model II Line Array Packaging View .............................................................................11 Packaging Part List, B1 Bass Module (see Figure 3) .................................................................. 12 Figure 3. B1 Bass Module Packaging View ......................................................................................12 Main Part List, Power Stand to Leg Assembly (see Figure 4) ..................................................... 13 Figure 4. Power Stand to Leg Assembly Exploded View ..................................................................13 Main Part List, L1 Model II Power Stand Upper Housing (see Figure 5) .................................... 14 Figure 5. Power Stand Upper Housing Exploded View .....................................................................15 Main Part List, L1 Model II Power Stand Cavity and Leg Assembly (see Figure 6) .................. 16 Figure 6. Power Stand Cavity and Leg Assembly Exploded View ...................................................17 Main Part List, L1 Model II Line Array (see Figure 7) ................................................................... 18 Figure 7. L1 Model II Line Array Exploded View ...............................................................................19 Main Part List, L1 Model II Line Array End Cap Assemblies (see Figure 8) .............................. 20 Figure 8. L1 Model II Line Array End Cap Assemblies Exploded View .............................................21 Main Part List, B1 Bass Module Exploded View (see Figure 9) .................................................. 22 Figure 9. B1 Bass Module Exploded View ........................................................................................22 Electrical Part Lists ................................................................................................................... 23-40 Input/Output PCB Assembly .................................................................................................... 23-33 Power Amplifier PCB Assembly .............................................................................................. 34-40 AC Primary PCB Assembly ............................................................................................................ 40 Disassembly Procedures .........................................................................................................41-46 Test Procedures ........................................................................................................................ 47-50 Appendix.................................................................................................................................... 51-55 Figure 10. L1 Model II Power Stand Wiring Diagram ........................................................................55 Theory of Operation .................................................................................................................. 56-62 Circuit Board Layout Diagrams ............................................................................................... 62-68 Figure 11. AC Input PCB Topside Etch and Layout ...................................................................... 62 Figure 12. AC Input PCB Bottom Etch and Layout ...................................................................... 62 Figure 13. DSP PCB Topside Etch and Layout ............................................................................. 63 Figure 14. DSP PCB Bottom Silk and Internal Layer 1 ................................................................ 64 Figure 15. DSP PCB Bottom Silk and Internal Layer 2 ................................................................ 65 Figure 16. DSP PCB Bottom Silk and Etch ................................................................................... 66 Figure 17. Amplifier/SMPS PCB Topside Etch Layout ................................................................. 67 Figure 18. Amplifier/SMPS PCB Internal Etch Layer 1 Layout .................................................... 67 Figure 19. Amplifier/SMPS PCB Internal Etch Layer 2 Layout .................................................... 68 Figure 20. Amplifier/SMPS PCB Bottom Etch Layout .................................................................. 68 Service Manual Revision History ................................................................................................... 69

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3 Safety Information 1. Parts that have special safety characteristics are identified by the symbol on schematics or by special notes on the parts list. Use only replacement parts that have critical characteristics recommended by the manufacturer. 2. Make leakage current or resistance measurements to determine that exposed parts are acceptably insulated from the supply circuit before returning the unit to the customer. Use the following checks to perform these measurements: A. Leakage Current Hot Check-With the unit completely reassembled, plug the AC line cord directly into a 120V AC outlet. (Do not use an isolation transformer during this test.) Use a leakage current tester or a metering system that complies with American National Standards Institute (ANSI) C101.1 "Leakage Current for Appliances" and Underwriters Laboratories (UL) 6500 / IEC 60056 paragraph 9.1.1. With the unit AC switch first in the ON position and then in OFF position, measure from a known earth ground (metal waterpipe, conduit, etc.) to all ex- posed metal parts of the unit (antennas, handle bracket, metal cabinet, screwheads, metallic overlays, control shafts, etc.), especially any exposed metal parts that offer an electrical return path to the chassis. Any current measured must not exceed 0.5 milliamp. Reverse the unit power cord plug in the outlet and repeat test. ANY MEASUREMENTS NOT WITHIN THE LIMITS SPECIFIED HEREIN INDICATE A POTENTIAL SHOCK HAZARD THAT MUST BE ELIMINATED BEFORE RETURNING THE UNIT TO THE CUSTOMER. B. Insulation Resistance Test Cold Check-(1) Unplug the power supply and connect a jumper wire between the two prongs of the plug. (2) Turn on the power switch of the unit. (3) Measure the resistance with an ohmmeter between the jumpered AC plug and each exposed metallic cabinet part on the unit. When testing 3 wire products, the resistance measured to the product enclosure should be between 2 and infinite MOhms. Also, the resistance measured to exposed input/output connectors should be between 4 and infinite MOhms. When testing 2 wire prod- ucts, the resistance measured to exposed input/output connectors should be between 4 and infinite MOhms. If it is not within the limits specified, there is the possibility of a shock hazard, and the unit must be repaired and rechecked before it is returned to the customer. CAUTION: The Bose ® L1 ® Model II system contains no user-serviceable parts. To prevent warranty infractions, refer servicing to warranty service stations or factory service. PROPRIETARY INFORMATION THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION OF BOSE CORPORATION WHICH IS BEING FURNISHED ONLY FOR THE PURPOSE OF SERVICING THE IDENTIFIED BOSE PRODUCT BY AN AUTHORIZED BOSE SERVICE CENTER OR OWNER OF THE BOSE PRODUCT, AND SHALL NOT BE REPRODUCED OR USED FOR ANY OTHER PURPOSE. The Bose L1 Model II Power Stand is covered by a limited 2-year transferable warranty. The L1 Model II Cylindrical Radiator ® and the B1 bass module are covered by a 5-year limited warranty. Warranty